SILICON TIMELINEBY VLSI KOREA

GLOBAL SEMICONDUCTOR RECORD

Semiconductor time,
on one global view.

Semiconductor news arrives in fragments while competitors move at the same time. Read company disclosures on a common timeline, with one normalized status vocabulary.

Explore the timeline Data methodology
Linked primary sourcesEvent-level citationsFuture targets separated
GLOBAL COMPARISON / 01The industry does not move in one line.
2012201820242027
FOUNDRY7nm HVMGAA
MEMORYHBM2HBM4
PACKAGE2.5DHYBRID
PRODUCTSMOBILE APAI GPU
RECORDS156
COMPANIES19
AS OF2026.07
01

CHOOSE A LENS

One industry,
four clocks.

Process density, bandwidth, connection density and commercial products evolve at different speeds—even in the same year. Choose an axis, then overlay company milestones.

01FOUNDRY / LOGIC

Foundry

Compare when major foundry process nodes moved from announcement to production on one normalized timeline.

7 companies34 verified events
02MEMORY / BANDWIDTH

Memory

Track DRAM, HBM and 3D NAND generation changes across development, sampling, production and shipment.

5 companies40 verified events
03ADVANCED PACKAGING

Advanced packaging

Trace how 2.5D, 3D and hybrid-bonding technologies moved from disclosure toward production platforms.

4 companies18 verified events
04SILICON PRODUCTS

Products

Follow mobile SoCs, graphics cards, client CPUs and AI accelerators from official announcement to commercial launch.

9 companies56 verified events
02

WHY STATUS MATTERS

NORMALIZED, NOT FLATTENED

Seven meanings
behind “launched.”

A roadmap announcement is not a commercial shipment. We preserve the source wording and add a conservative normalized status so readers can compare events without flattening their differences.

Read the status definitions
01Official announcementThe company formally disclosed a new technology or platform.
02Development completeThe company reported development completion or implementation readiness.
03Customer samplingSamples were provided to customers or partners for validation.
04Risk productionInitial production, including yield learning, began.
05Mass productionThe company explicitly reported mass or volume production.
06Commercial shipmentThe company reported shipment of commercial products to customers.
07Future targetA future production or shipment target, separated from completed events.
03

LATEST VERIFIED

Latest verified
movements.

Ordered by the reported event period—not merely the publication date. Non-exact dates are labeled as ranges.

Mar 16, 2026Micron36GB 12-high HBM4HBM4 reaches high-volume production and shipmentShippedFeb 12, 2026SamsungHBM4 / 12-highHBM4 enters production and commercial shipmentShippedJan 27, 2026IntelIntel 18A / Panther LakeFirst Intel 18A PC products reach marketShippedQ4 2025TSMCN2 (2nm nanosheet)N2 enters high-volume manufacturingMass prod.Late 2025IntelIntel 18AIntel 18A enters high-volume manufacturingMass prod.
1°

SOURCE PROMISE

Evidence behind
every point.

We prioritize company newsrooms, technical pages, annual reports and standards bodies. Every event links to its original record, and year-, month- or period-level uncertainty is shown rather than hidden. Coverage is curated and non-exhaustive.

Read verification rules Monthly updates