MEMORY / BANDWIDTH
Memory technology timeline
Track DRAM, HBM and 3D NAND generation changes across development, sampling, production and shipment.
“Which signal behind a generation name is closest to real customer adoption?”
Shape, line style and text encode event status.
The same color marks a curated comparison cohort across companies—not physical equivalence.
DATA NOTEOpen an event for its source and date precision. Month, period and year records are plotted as uncertainty bands; future targets use dashed styling.
Data as of 2026.07.15
Read status and evidence before names.
DRAM process generations and NAND layer counts are different axes and are not directly comparable. The timeline preserves each company’s names while normalizing announcement, development, sampling, risk production, mass production and shipment.