ADVANCED PACKAGING

Advanced packaging timeline

Trace how 2.5D, 3D and hybrid-bonding technologies moved from disclosure toward production platforms.

When did packaging become a system-performance turning point beyond process scaling?

4companies
18verified milestones
2012–2027coverage
STATUS SHAPE

Shape, line style and text encode event status.

AnnouncedDevelopedSamplingRisk prod.Mass prod.ShippedTarget
FAMILY COLOR

The same color marks a curated comparison cohort across companies—not physical equivalence.

2.5D bridge / interposerFan-out / panel-level3D stacking / hybrid bonding

COMPARE DESK

Overlay company timelines.

MY TIMELINE / LOCAL WORKSPACE

Keep a comparison worth returning to.

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Company
19 milestones4 companies selected
YEAR
201220142016201820202022202420262028
TSMC6
Intel5
Samsung4
ASE4

DATA NOTEOpen an event for its source and date precision. Month, period and year records are plotted as uncertainty bands; future targets use dashed styling.

Data as of 2026.07.15

READ 01

Read status and evidence before names.

Packaging brands differ in structure, pitch and production readiness; matching colors indicate a comparison cohort, not physical equivalence. The timeline preserves each company’s names while normalizing announcement, development, sampling, risk production, mass production and shipment.

Read classification rules